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Product Details:
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| Material: | Lead Frame Or Terminal Connector | Coating Type: | Copper、nickel、silver、gold、tin，select Plating Type According To Product Requirements |
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| Coating Thickness: | According To Product Requirements | Product Lines: | 1，2，4 Or 8 Lines |
| Speed: | 5~30m/min | ||
| High Light: | Leadframe Electroplating Machine,Terminal Connectors Electroplating Machine,Electroplating Machine 30m/Min |
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Leadframe Electroplating Machine Terminal Connectors Electroplating Machine
1. Main parameters of lead frame and terminal connector electroplating machine
| No | Item | Specification |
| 1 | material | lead frame or terminal connector |
| 2 | coating type | copper,nickel,silver,gold,tin,select plating type according to product requirements |
| 3 | coating thickness | according to product requirements |
| 4 | product lines | 1,2,4 or 8 lines |
| 5 | speed | 5~30m/min |
2. Technological process of production
pay off→ ultrasonic degreasing→ water rinsing →cathode degreasing → water rinsing → anode degreasing → water rinsing →pickling→ water rinsing → copper plating or nickel plating(selective) → recovery → water rinsing → pre-silver plating or anti-replacement → local silver plating or gold plating(selective)→ recovery → water rinsing → silver withdrawal (selective)→ water rinsing → tin plating(selective) → recovery → water rinsing →protection → water rinsing → hot water rinsing → drying →CCD→ take up
3. Main process introduction
Cathode degreasing: remove the oil on the surface of product to ensure the binding force of the coating .
Anode degreasing: same as the cathode degreasing.
Pickling: remove the oxide from the surface of the product.
Water rinsing: clean the product thoroughly after the tank to avoid mutual contamination of the tank.
Copper plating or nickel plating: as a pre-coating, to ensure the subsequent coating and base binding force.
Silver plating: partial silver plating of functional areas.
Gold plating: partial gold plating of functional areas.
Tin plating: partial tin plating of functional areas.
Protection: a protective film is formed on the surface of the product to prevent oxidation and discoloration of the coating during transit and storage.
CCD: detect whether there are defects in the coating of the functional area .
4. Photos
The appearance of the electroplating machine
Pay off
Buffer
Tin electroplating
CCD
5.Product application
(1)LED lighting and display
(2)integrated circuit component
(3)chip carrier of integrated circuit
6.Packaging & Shipping
We can pack it by pallet, or according to the customers' specific requirements.
Port: Shanghai/Ningbo
7. Our Services
In order to guarantee the customers are able fully to operate the machine, if the customer need, we can help customer training, includes:
(1) Correct operating mode
(2) Correct maintenance way
(3) Correct technological process control
(4) Remove simple problem
All the electroplating machine of our company have already been widely used in electroplating area.
Any doubt please contact us.
Contact Person: Mrs. YeGuiFeng
Tel: +86 85778256
Fax: 86-571-85778267
